전자 패키징
마이크로전자패키징 테스트킷 디자인&제작
LED 패키지 디지안&제작
스트레쳐블 전자부품 디자인&제작
울트라본딩 기술
전자 패키징 내 High RF 규격화
드랍 및 고속 전단테스트 규격화
나노 페이스트 및 나노 잉크 전도성 패터닝
마찰용접 (FW)
마찰교반용접
마찰교반점용접
학력
1993 오사카대학교 금속재료 박사
1995~현재 성균관대학교 신소재공학부 교수
약력/경력
지자체 주도 마이크로전자패키징사업단 단장 (2004. 10. - )
(사) 한국 마이크로 전자 및 패키징 학회 회장 (2019. 01~2020.12)
(사) 한국 동 및 동합금 연구회 부회장 (2006.02~)
(사) 한국 전자패키징 연구조합 이사장 (2017.01~2018.12)
학술지 논문
(2024)
Microstructural Optimization of Sn-58Bi Low-Temperature Solder Fabricated by Intense Pulsed Light (IPL) Irradiation.
CRYSTALS.
14,
5
(2024)
Effect of thickness in the SAC 305 plated layer on the interfacial reaction and mechanical properties of the CCSB joint assembled onto the OSP surface finished FR-4 PCB board.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS.
35,
7
(2024)
Improving mechanical stability of Al/Cu ultrasonic bonded joint for battery tab by adopting electroplated Ni interlayer.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS.
35,
4
(2023)
Water-Triggered Self-Healing of Ti3C2Tx MXene Standalone Electrodes: Systematic Examination of Factors Affecting the Healing Process.
SMALL.
n/a,
n/a
(2023)
Advances in Silver Nanowires-Based Composite Electrodes: Materials Processing, Fabrication, and Applications.
ADVANCED MATERIALS TECHNOLOGIES.
8,
19
(2023)
Low-melting metal thermal interface material for high-power package application.
JOURNAL OF THE KOREAN PHYSICAL SOCIETY.
83,
6
(2023)
Proposal of intense pulsed light soldering process for improving the drop impact reliability of Sn–3.0 Ag–0.5 Cu ball grid array package.
JOURNAL OF MANUFACTURING PROCESSES.
98,
(2023)
Self-Repairing and Energy-Harvesting Triboelectric Sensor for Tracking Limb Motion and Identifying Breathing Patterns.
ACS APPLIED MATERIALS & INTERFACES.
15,
24
(2023)
Role of Oxygen in the Ti3AlC2 MAX Phase in the Oxide Formation and Conductivity of Ti3C2-Based MXene Nanosheets.
ACS APPLIED MATERIALS & INTERFACES.
15,
6
(2023)
Intense Pulsed Light Soldering of Sn–3.0Ag–0.5Cu Ball Grid Array Component on Au/Pd(P)/Ni(P) Surface-Finished Printed Circuit Board and Its Drop Impact Reliability.
ADVANCED ENGINEERING MATERIALS.
25,
10
(2023)
Electronic textiles: New age of wearable technology for healthcare and fitness solutions.
MATERIALS TODAY BIO.
19,
(2022)
Recent progress of Ti3C2Tx-based MXenes for fabrication of multifunctional smart textiles.
APPLIED MATERIALS TODAY.
29,
(2022)
Investigation of interfacial reactions between Sn-Ag-Bi-In solder and (Cu, electroless Ni-P/Cu) substrate.
INTERNATIONAL JOURNAL OF MATERIALS RESEARCH.
94,
4
(2022)
Interfacial reaction and shear strength of Sn-0.7Cu solder/electrolytic Ni joints with reflow time.
INTERNATIONAL JOURNAL OF MATERIALS RESEARCH.
96,
12
(2022)
Effects of the local microstructures on the mechanical properties in FSWed joints of a 7075-T6 Al alloy.
INTERNATIONAL JOURNAL OF MATERIALS RESEARCH.
96,
8
(2022)
High-temperature stability of Ni-Sn intermetallic joints for power device packaging.
JOURNAL OF ALLOYS AND COMPOUNDS.
890,
1
(2022)
Effect of microstructural variation on the Cu/CK45 carbon steel friction weld joint.
INTERNATIONAL JOURNAL OF MATERIALS RESEARCH.
94,
12
(2021)
Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High-Temperature Storage Test.
JOURNAL OF ELECTRONIC MATERIALS.
50,
10
(2021)
Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for Cu-Ni bonding.
APPLIED SURFACE SCIENCE.
551,
-
(2021)
Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior.
JOURNAL OF ALLOYS AND COMPOUNDS.
863,
단행본
(2011)
Handbook of Adhesion Technology.
Springer.
공동
(2004)
무연 솔더 실장 기술.
삼성북스.
단독
(2003)
신소재공학.
삼성북스.
공동
(2002)
용접정밀접합.
원창출판사.
공동
특허/프로그램
이종 금속 재료 간의 접합을 위한 천이액상소결접합 방법.
10-2019-0025595.
20200820.
대한민국
자기력을 이용한 금속 재료 간의 천이액상접합 방법.
10-2019-0065101.
20200701.
대한민국
광소결을 이용해 재배선층을 형성하는 방법(METHOD OF FORMING REDISTRIBUTION LAYER USING PHOTO―SINTERING).
10-2040-5300000.
20191030.
대한민국
주석-다층탄소나노튜브 복합체의 제조방법(METHOD FOR PREPARING SN―MWNT COMPOSITE).
10-1939-4430000.
20190110.
대한민국
금속부재 및 세라믹부재를 접합하는 방법.
10-2012-0021706.
20130905.
대한민국
기계적 특성의 향상을 위한 ENEPIG 표면처리에서의 최적의 팔라듐 함유량.
10-2011-0078897.
20130627.
대한민국
마찰교반 접합방법 및 이를 이용한 접합 구조체.
10-2011-0053767.
20130618.
대한민국
교류 전원 제어 장치 및 방법.
10-2010-0061330.
20130403.
대한민국
구리 합금 판재를 이용한 열방출이 용이한 디스플레이 패널용 보강 프레임 및 그 제조방법(A REINFORCEMENT FRAME FOR FACILLITATING THERMAL EMISSION USING A COPPER BOARD AND A MANUFACTURING METHOD THEREOF).
10-1199660-0000.
20121102.
대한민국
열방출이 용이한 디스플레이 패널용 보강 프레임 및 그 제조 방법(A REINFORCEMENT FRAME FOR FACILLITATING THERMAL EMISSION AND A MANUFACTURING METHOD THEREOF).
10-1199724-0000.
20121102.
대한민국
접합부의 최고온도 및 냉각속도를 조절할 수 있는 마찰교반 접합장치 및 마찰교반 접합방법(Apparatus and method for friction stir welding capable of controlling maximum temperature and cooling speed of joint).
10-1199471-0000.
20121102.
대한민국
금속 중공구의 제조 방법 (Method for manufacturing Metal hollow sphere).
1009438260000.
20100216.
대한민국
마찰교반 접합장치 및 방법.
10-2009-0123380.
20091211.
대한민국
구리 포스트 형성을 통한 고강도 솔더범프 제조방법.
10-2007-0070499.
20081121.
대한민국
구리 포스트 형성을 통한 고강도 솔더범프 제조방법.
10-2007-0070499.
20081121.
대한민국
전기적 특성 평가가 가능한 플립칩 및 이것의 제조 방법.
12/203, 280.
20080903.
미국
다층 감광막을 이용한 금속마스크 제작 방법 및 금속 마스크.
10-0727371-00-00.
20070619.
대한민국
청동합금계 분말결합재를 이용한 절삭가공용 다이아몬드 휠의 제조방법.
0448465.
20040902.
대한민국
청동합금계 결합재를 이용한 절삭 가공용 다이아몬드 휠과 알루미늄 플랜지와의 접합방법.
0438002.
20040618.
대한민국
수상/공훈
성균관대 펠로우 교수 (성균관대학교,2010)
Haidong grand Prize(The Korean Microelectronic and Package Society(2011)
Grand Prize in Academic (The Korean Welding and Joining Society (KWJS), 2014)
해동논문상 (한국마이크로전자패키징학회, 2008)
Best paper award (Japan Copper and Brass Association, 2004)
학술회의논문
(2024)
Proposal Ultrafast Soldering of the BGA package for Carbon Neutrality.
MAM.
이탈리아
(2023)
Effect of Ceramic Filler in Epoxy Mold Compound on Thermomechanical Property of FOWLP.
ECTC.
미국
(2023)
Enhancement of Ga-21.5 In-10 Sn Eutectic Alloy Based Thermal Interface Material Incorporating Cu Flake.
ECTC.
미국
(2021)
The Transient Liquid Phase Bonding by Ultrasonic-Assisted Soldering of Cu Contained Sn-58Bi Solder paste for High-Temperature Packaging Applications.
6th International Conference on Advanced Electromaterials.
대한민국
(2021)
Drop Properties of Wafer level Package Modules with Various Underfill Materials.
The 19th International Symposium on Microelectronics and Packaging.
대한민국
(2021)
Effect of EMI Shielding Fillers in EMC on RF Characterization in Range of 18GHz for Fan-out Package Structure.
The 19th International Symposium on Microelectronics and Packaging.
대한민국
(2021)
Evaluation of Bending Characteristics of WLP Module with Three Types of Underfill.
The 19th International Symposium on Microelectronics and Packaging.
대한민국
(2021)
Mechanical Reliability of Cu Core Solder Joints after Electromigration.
명 The 19th International Symposium on Microelectronics and Packaging.
대한민국
(2021)
Predicting the Mechanical, Creep Properties of BGA Solder Joints through Nanoindentaion.
The 19th International Symposium on Microelectronics and Packaging.
대한민국
(2021)
The Transient Liquid Phase Bonding by Ultrasonic-assisted Soldering of Cu Contained Sn-58Bi solder paste for High-temperature Packaging Applications.
The 19th International Symposium on Microelectronics and Packaging.
대한민국
(2021)
언더필 종류에 따른 WLP 모듈의 낙하충격특성 평가.
한국화학공학회 2021년도 가을 총회 및 국제 학술대회.
대한민국
(2021)
Fast formation of intermetallic compounds by transient liquid phase bonding with porous Cu for interconnection of power modules.
International Symposium on Innovation in Materials Processing 2021.
대한민국
(2021)
Low Temperature Transient Liquid Phase Bonding by using Eutectic In-48Sn Alloy for Cu-Ni Bonding.
International Union of Materials Research Societies - International Conference in Asia 2021.
대한민국
(2021)
Mechanical Properties and Microstructures of Cu/In-48Sn Alloy/Cu with Low Temperature TLP bonding.
International Union of Materials Research Societies - International Conference in Asia 2021.
대한민국
(2021)
Microstructural Evolution of In-48Sn Solder Joints with the Intense Pulsed Light Soldering Process.
International Union of Materials Research Societies - International Conference in Asia 2021.
대한민국
(2021)
Microstructure evolutions and mechanical properties of SAC305 with the intense pulsed light soldering process under high temperature storage test.
ECTC 2021.
미국
(2021)
Cu hybrid paste의 IPL 저온 소결 및 특성 분석.
KMEPS 2021.
대한민국
(2021)
다양한 전류밀도에서 SAC305/Sn58Bi BGA 구조 솔더 접합부의 전기적마이그레이션 거동.
KMEPS 2021.
대한민국
(2021)
에폭시 몰딩 컴파운드에 첨가한 Fe-3.5wt.%Si-4wt.%Cr 파우더 함량에 따른 차폐능 특성.
KMEPS 2021.
대한민국
(2021)
에폭시 몰딩 컴파운드의 방열필러에 따른 팬아웃 패키지의 뒤틀림 거동 및 방열특성.
KMEPS 2021.
대한민국
발전기금
