For more details on the courses, please refer to the Course Catalog
| Code | Course Title | Credit | Learning Time | Division | Degree | Grade | Note | Language | Availability |
|---|---|---|---|---|---|---|---|---|---|
| CHS7002 | Machine Learning and Deep Learning | 3 | 6 | Major | Bachelor/Master/Doctor | Challenge Semester | - | No | |
| This course covers the basic machine learning algorithms and practices. The algorithms in the lectures include linear classification, linear regression, decision trees, support vector machines, multilayer perceptrons, and convolutional neural networks, and related python pratices are also provided. It is expected for students to have basic knowledge on calculus, linear algebra, probability and statistics, and python literacy. | |||||||||
| COV7001 | Academic Writing and Research Ethics 1 | 1 | 2 | Major | Master/Doctor | SKKU Institute for Convergence | Korean | Yes | |
| 1) Learn the basic structure of academic paper writing, and obtain the ability to compose academic paper writing. 2) Learn the skills to express scientific data in English and to be able to sumit research paper in the international journals. 3) Learn research ethics in conducting science and writing academic papers. | |||||||||
| COV7005 | ABCD Academic Writing and Research Ethics | 1 | 2 | Major | Master/Doctor | SKKU Institute for Convergence | Korean | Yes | |
| This course provides an easy-to-understand introduction to the principles of paper writing, which are the core of writing research papers, from the basics to the application of the ‘ABCD’ method, including the use of the latest artificial intelligence tools. Learning Objectives: 1. Basic understanding of paper writing methods 2. Learning the latest techniques for paper writing 3. Mastering paper writing using artificial intelligence 4. Learning proper paper writing based on research ethics | |||||||||
| EAM2003 | Advanced Defects in Materials | 3 | 6 | Major | Bachelor | 2-3 | Advanced Materials Science and Engineering | - | No |
| Various kinds of defects in solid and resultant properties will be studied. Basically, effect of stacking fault, vacancy, dislocation, grain boundary, twinning, impurity on properties will be introduced. Specifically, various kinds of dislocation such as screw dislocation, edge dislocation, immobile dislocation, mobile dislocation, and crooked dislocation, dislocation reaction, dislocation source, stress field produced by dislocation, and dislocation motion will be studied. In addition, variations of mechanical and electrical properties dislocations will be discussed. | |||||||||
| EAM4014 | Global Techno Management | 2 | 4 | Major | Bachelor/Master | 1-4 | - | No | |
| The requirement and problem of the real technology in the industrial field are analyzed by inviting specialists and CEOs to learn the ability of solving the industrial problem. Also, management and commencement of an enterprise are studied. | |||||||||
| EAM4017 | Metals | 3 | 6 | Major | Bachelor/Master | Korean | Yes | ||
| This field studies the properties of metals and alloys as affected by manufacturing, mechanical deformation and heat treatment which is concerned with the physical, mechanical and chemical characteristics of metals and alloys. This course includes phase transformation, welding metallurgy, fracture mechanics, and corrosion for alloy design. | |||||||||
| EAM4018 | Electric and Electronic Materials | 3 | 6 | Major | Bachelor/Master | - | No | ||
| ELECTRIC AND ELECTRONIC MATERIALS IS THE SUBJECT TO EXPLORE THE ELECTRONIC PROPERTIES OF SOLIDS AT THE UNDERGRADUATE LEVEL, WHILE PROVIDING AN INTEGRATED AND BALANCED STUDY OF SOLID-STATE PHYSICS, MATERIALS, AND DEVICE APPLICATIONS. THIS CLASS ALSO FEATURES A DESIGN EXERCISES THAT EXTEND AND MOTIVATE THE PRESENTATION OF SOLID-STATE THEORIES, MATERIALS' STRUCTURES AND PHYSICAL PROPERTIES, AND THEN EXPLORES THE PROPERTIES AND APPLICATIONS OF SPECIFIC SOLIDS, INCLUDING METALS, SEMICONDUCTORS, INSULATORS, MAGNETIC SOLIDS, SUPERCONDUCTORS, AND LIGHT-SENSITIVE SOLIDS. | |||||||||
| EAM4019 | Electronic Package Engineering | 3 | 6 | Major | Bachelor/Master | - | No | ||
| The electronic package engineering is a fusion technology closely related to mechanical engineering, electron engineering, materials engineering, and chemical engineering etc. Component or electronics are assembled with different functional devices, and the length of circuit is approaches to a few m. The troubles (Ohm match, corrosion, mechanical problems etc.) caused at the interface between different devices or materials can be solved by various surface finishes such as ENIG, ENEPIG, OSP, HASL, electro plating, and electroless plating etc. Electronic package technology requires many functions such as thermal management, power redistribution, signal distribution and mechanical support. The electronic package components must meet their characteristics after reliability test such as IPC, JEDEC etc. This lecture introduces the manufacture process of electronic package components and the core technologies including materials for electronic packaging, system in packaging, system on chip, printed circuit board, surface finishes, flip chip, through silicon via, the materials and process for interconnection technology, printed electronics, the reliability regulation for electronic components, and test kits etc. | |||||||||
| EAM4020 | Introduction to organic and polymeric materials | 3 | 6 | Major | Bachelor/Master | English | Yes | ||
| This course introduces structures, properties, synthesis, and applications of various organic and polymeric materials. | |||||||||
| EAM4021 | Backplane device process | 3 | 6 | Major | Bachelor/Master | - | No | ||
| The basic unit element in the display and semiconductor memory fields is the transistor, which is used under the names of thin film transistor (TFT) and metal-oxide-semiconductor field effect transistor (MOSFET), respectively. This course Understand the basic structure and operating principles of transistors, which are basic unit devices in the high-tech industry, learn about materials/processes/devices for TFTs applied in the display industry, and learn the process of directly producing actual TFT unit devices. Also, we will Learn the process of operation and evaluation. | |||||||||
| EAM4022 | Electrochemistry of Advanced Materials | 3 | 6 | Major | Bachelor/Master | Korean | Yes | ||
| Analyses of electrochemistry reaction in terms of chemical, electrochemical, metallurgical techniques. Mechanisms and control of electrochemistry reaction, thermodynamics and kinetics of corrosion reactions, design of cathodic protection. | |||||||||
| EAM4023 | Next-Generation Semiconductor Virtual Fab | 3 | 6 | Major | Bachelor/Master | 1-4 | Korean | Yes | |
| By utilizing the 3D Semulator tool in a virtual fab environment to design nm-scale FinFET processes, students gain an understanding of next-generation semiconductor processing technologies and the latest semiconductor devices. | |||||||||
| EAM5201 | Crystal Chemistry | 3 | 6 | Major | Master/Doctor |
1-4
1-4 |
English | Yes | |
| Crystals are classified into ionic, covalent and metallic crystals in terms of the nature of bond. Corresponding physical properties of the crystals are introduced. The nature of the bond in crystals is explained by lattice energy theory, molecular orbital theory or band theory. | |||||||||
| EAM5202 | Semiconductor Analysis | 3 | 6 | Major | Master/Doctor | 1-4 | Korean | Yes | |
| Basic physics related to electrical and optical properties of semiconductor. Principle and characteristics of various analytical techniques including DLTS, Hall, Electrochemical C-V, PITCS, PL, AES, and EPMA | |||||||||
| EAM5203 | Thermodynamics of Solid | 3 | 6 | Major | Master/Doctor | 1-4 | English | Yes | |
| The more detailed thermodynamic relations in solid solution and reaction will be discussed, which are based on the basic thermodynamic concepts. | |||||||||